STANDARD VOLUME ASSEMBLY
Features:
- Placement speed: 20,000 placements per hour
- Placement accuracy: 50 μm @ 3 σ
- Component spectrum: 0402 (mm) to 150 mm × 45 mm × 25 mm
- Board size: 80 mm × 50 mm to 500 mm × 450 mm
Line includes:
- Laser marking
- FUJI XP-143E SMT Placement
- FUJI XP-243E SMT Placement
- Reflow Oven
- 2D AOI Inspection
THRU-HOLE ASSEMBLY
Line includes:
- KAIT THT Flux
- KAIT THT Wave soldering Lead-free
- MES / TRACEABILITY system for component and data tracing
THERMAL INTERFACE MATERIAL ASSEMBLY
Line includes:
- ASM DEK Neohorizon Thermal-Interface-Material Printer
- Thermal-Interface-Material oven
- Thermal-Interface-Material 3D SPI Inspection
- MES / TRACEABILITY system for component and data tracing
OTHER ASSEMBLY EQUIPMENT
Includes:
- MODI Automatic Incoming Material Capturing
- Semi-Automatic Depaneling
- Semi-Automatic Coating
- SPEA ICT / FCT Testing Equipment
- Keyence Measurement projector